Modern technologies for the laser cutting of micro- and optoelectronics materials

Kondratenko, V.S., Kadomkin, V.V., Naumov, A.S., Velikovsky, I.E.

Publication in Journal of Optical Technology

For Russian citation (Opticheskii Zhurnal):

Кондратенко В.С., Кадомкин В.В., Наумов А.С., Великовский И.Э. Современные технологии лазерной резки материалов микро- и оптоэлектроники // Оптический журнал. 2022. Т. 89. № 2. С. 68–79. http://doi.org/10.17586/1023-5086-2022-89-02-68-79

Kondratenko V.S., Kadomkin V.V., Naumov A.S., Velikovskiy I.E. Modern technologies for the laser cutting of micro- and optoelectronics materials [in Russian] // Opticheskii Zhurnal. 2022. V. 89. № 2. P. 68–79. http://doi.org/10.17586/1023-5086-2022-89-02-68-79

For citation (Journal of Optical Technology):

Vladimir Stepanovich Kondratenko, Viktor Viktorovich Kadomkin, Aleksander Sergeevich Naumov, and Ilya Éduardovich Velikovskiy, "Modern technologies for the laser cutting of micro- and optoelectronics materials," Journal of Optical Technology. 89(2), 113-120 (2022). https://doi.org/10.1364/JOT.89.000113

Abstract:

Subject of study. This paper analyzes the possibilities of two modern technologies that the authors have developed for high-precision dimensional cutting and microprocessing of such materials as glass, sapphire, and semiconductor materials and that are widely used in micro- and optoelectronics and instrumentation. Method. The technologies thus developed ensure that the border (zone) has few or no defects after being processed and are based on methods of laser-controlled thermocracking (LCT) and laser immersion processing of materials. Main results. This paper describes a physical model of the method of LCT and its advantages over known technologies because the cutting process is free of waste (the cut has zero width) and has a high cutting velocity (up to 1000 mm/s) and increased mechanical strength of the edge. The paper presents the optimum layout for cutting instrumental wafers from various materials into chips by the method of LCT. It describes an original method of cutting holes in glass by the method of LCT and at the same time analyzes the limitations of this method for cutting along a curvilinear contour and cutting out holes. The limitations and drawbacks of cutting holes by means of lasers with supershort pulses are considered, and an alternative solution is proposed that allows the technological limitations to be overcome by means of a new method of laser immersion cutting of materials. A description is given of the role of the heat accumulator formed in the contact zone when brittle nonmetallic materials that are transparent for the laser’s wavelength are processed by the immersion cutting of materials. Chemical thermodynamics is used to estimate the chemical composition of the substance in the heat accumulator when the laser radiation is absorbed. The paper explains the role of the immersion liquid when laser immersion cutting is used to drill microholes less than 200 µm in diameter. The results, features, and advantages of the new technology are presented. Practical significance. Since each of the technologies described here has, along with indisputable advantages, a number of technological limitations, combining these two technologies allows virtually any technological problems in the area of high-precision processing of brittle nonmetallic materials to be solved and opens up new possibilities for developing new technologies and products. In particular, technologies and equipment have been developed for high-precision cutting of glass products of complex curvilinear shape with minimal radius of curvature and increased strength of the edges.

Keywords:

optoelectronic devices, instrumentation wafers, scribing, laser-controlled thermocracking, laser immersion material processin

OCIS codes: 350.3390

References:

1. “Stealth Dicing engine,” https://www.hamamatsu.com/us/en/product/semiconductor-manufacturing-support-systems/stealth-dicing-engine(TM).html.
2. C. Leone, V. Lopresto, N. Pagano, S. Genna, and I. De Iorio, “Laser cutting of silicon wafer by pulsed Nd:YAG source,” in 6th IPROMS (2010).
3. W. Li, Y. Huang, Y. Rong, L. Chen, G. Zhang, and Z. Gao, “Analysis and comparison of laser cutting performance of solar float glass with different scanning modes,” Front. Mech. Eng. 16(1), 97–110 (2021).
4. K. Mishchik, C. Javaux, O. Dematteo-Caulier, S. Skupin, B. Chimier, G. Duchateau, A. A. Bourgeade, R. Kling, A. Letan, C. Hönninger, E. Mottay, and J. Lopez, “Femtosecond laser cutting of glass by controlled fracture propagation,” in Conference on Lasers and Electro-Optics (CLEO), San Jose, California (2015), paper AM1K.3.
5. V. S. Kondratenko, “Method of cutting brittle materials,” Russian Federation patent 2,024,441 (1994).
6. V. S. Kondratenko and S. A. Kudzh, “Precision cutting of glass and other brittle materials by laser-controlled thermal splitting (Review),” Steklo Keram. (3), 5–12 (2017).
7. V. S. Kondratenko and S. A. Kudzh, “Precision cutting of glass and other brittle materials by laser-controlled thermo-splitting (Review),” Glass Ceram. 74(3–4), 75–81 (2017).
8. V. S. Kondratenko, V. E. Borisovsk, P. D. Gindin, and A. S. Naumov, “New laser-processing technologies for items of optical instrumentation,” Pribory 3(93), 36–39 (2008).
9. I. V. Golubyatnikov, V. S. Kondratenko, and A. B. Zhimalov, “Developing the theory and practice of a method of laser-controlled thermocracking,” Pribory 12(114), 1–6 (2009).
10. V. S. Kondratenko, Laser Processing of Materials (Nauka i Tekhnologii, Moscow, 2011).
11. V. S. Kondratenko and A. S. Naumov, “Development and introduction of technologies of laser-controlled thermocracking on the international market,” Vestn. MGTU MIREA 2(3(8)), 1–11 (2015).
12. V. S. Kondratenko, A. S. Naumov, and A. Yu. Rogov, “Introduction of laser technology controlled thermo-cracking in Russia,” Ross. Tekhnol. Zh. 5(1), 3–14 (2017).
13. D. Lewke, K. O. Dohnke, H.-U. Zühlke, M. C. Barreto, M. Schellenberger, A. Bauer, and H. Ryssel, “Thermal laser separation—a novel dicing technology fulfilling the demands of 4H-SiC volume manufacturing,” Mater. Sci. Forum 821–823(6), 528–532 (2015).
14. J. Serbin and G. Oulundsen, “Lasers improve display glass cutting,” Inf. Disp. 33(5), 38–41 (2017).
15. G.-H. Kim, D.-H. Choo, B.-K. Jeon, and H.-W. Nam, “Method and apparatus for cutting substrate using coolant,” U.S. patent application 0052098A1 (2003).
16. V. S. Kondratenko and A. S. Naumov, “Method of cutting wafers composed of brittle materials,” Russian Federation patent 2,404,931 (2010).
17. V. S. Kondratenko and A. S. Naumov, “New technology for laser cutting of sapphire wafers into chips,” Pribory 10(136), 37–41(2011).
18. V. S. Kondratenko, A. K. Zobov, A. S. Naumov, and K.-T. Lu, “Technology for precision laser cutting of sapphire wafers,” Fotonika 2(50), 42–52 (2015).
19. V. S. Kondratenko and V. I. Ivanov, “Technology for laser cutting of silicon wafers into organic light-emitting diode chips,” Ross. Tekhnol. Zh. 4(3), 11–17 (2016).
20. V. S. Kondratenko and V. I. Ivanov, “How methods of cutting silicon substrates affect the quality of organic LEDs,” Prikl. Fiz. (1), 36–40 (2017).
21. M.-C. Hsu and V. S. Kondratenko, “Brittle non-metallic workpiece with through hole and method for making same,” U.S. patent 38,418,280B2 (2013).
22. L. A. Hof and J. A. Ziki, “Micro-hole drilling on glass substrates—a review,” Micromachines 8(2), 53 (2017).
23. L. M. Ozherelkova and E. S. Savin, “The temperature dependence of unsteady heat conduction in solids,” Ross. Tekhnol. Zh. 7(2), 49–60 (2019).
24. V. S. Kondratenko, V. V. Kadomkin, H.-T. Lu, A. S. Naumov, and I. E. Velikovskii, “Laser drilling of microholes in glass,” Glass Ceram. 77, 39–42 (2020) [Steklo Keram. (2), 3–7 (2020)].
25. V. S. Kondratenko, V. V. Kadomkin, K.-T. Lu, A. S. Naumov, and I. E. Velikovskiy, “Mechanism of laser immersion processing of glass,” Glass Ceram. 77, 121–126 (2020) [Steklo Keram. (4), 3–9 (2020)].
26. V. S. Kondratenko, V. V. Kadomkin, K.-T. Lu, A. S. Naumov, and I. E. Velikovski, “Technology of laser immersion processing of materials,” Pribory 4(238), 1–8 (2020).
27. D. J. Hwang, T. Y. Choi, and C. P. Grigoropoulos, “Liquid-assisted femtosecond laser drilling of straight and three-dimensional microchannels in glass,” Appl. Phys. A 79, 605–612 (2004).
28. A. Kruusing, “Underwater and water-assisted laser processing: Part 2—etching, cutting, and rarely used methods,” Opt. Laser Eng. 41, 329–352 (2002).
29. R. Murakami, H. Nakagawa, and S. Matsuo, “Water-assisted laser drilling for miniature internal thread in glass and evaluation of its strength,” J. Laser Micro/Nanoeng. 12(3), 203–206 (2017).
30. H.-T. Lu, A. Naumov, and V. Kondratenko, “Multi-laser cutting method and system,” Taiwan patent 108115779 (2018).
31. V. S. Kondratenko, H.-T. Lu, A. S. Naumov, I. E. Velikovskiy, W.-Y. Wang, and X.-H. Peng, “Application of LCT technology in LCD cutting equipment for automotive industry” (29 April 2020), https://www.laserfair.com/news/202004/29/75830.html.
32. V. S. Kondratenko, A. N. Kobysh, H.-T. Lu, A. S. Naumov, and I. E. Velikovski, “New technology of two-laser cutting of glass along a curvilinear contour,” Steklo Keram. (6), 12–15 (2020).
33. V. S. Kondratenko, A. N. Kobysh, H.-T. Lu, A. S. Naumov, and I. E. Velikovskii, “Glass cutting technology combining two different lasers,” Glass Ceram. 77(5–6), 212–214 (2020).