Investigation of the damage to hybrid infrared photodetectors upon multiple cycles of cooling to liquid-nitrogen temperatures using an interference technique

Aldokhin, P.A., Dobrovolskyi, P.P., Matochkin, A.E., Novoselov, A.R.

Full text «Opticheskii Zhurnal»

Full text on elibrary.ru

Publication in Journal of Optical Technology

For Russian citation (Opticheskii Zhurnal):

Новоселов А.Р., Алдохин П.А., Добровольский П.П., Маточкин А.Е. Исследование разрушения гибридных фотоприемников инфракрасного диапазона при многократных циклах охлаждения до температуры жидкого азота интерференционным методом // Оптический журнал. 2021. Т. 88. № 1. С. 69–75. http://doi.org/10.17586/1023-5086-2021-88-01-69-75

Novoselov A.R., Aldokhin P.A., Dobrovolskii P.P., Matochkin A.E. Investigation of the damage to hybrid infrared photodetectors upon multiple cycles of cooling to liquid-nitrogen temperatures using an interference technique [in Russian] // Opticheskii Zhurnal. 2021. V. 88. № 1. P. 69–75. http://doi.org/10.17586/1023-5086-2021-88-01-69-75

For citation (Journal of Optical Technology):

A. R. Novoselov, P. A. Aldokhin, P. P. Dobrovolskii, and A. E. Matochkin, "Investigation of the damage to hybrid infrared photodetectors upon multiple cycles of cooling to liquid-nitrogen temperatures using an interference technique," Journal of Optical Technology. 88(1), 49-54 (2021). https://doi.org/10.1364/JOT.88.000049

Abstract:

The influence of the surface curvature of hybrid photodetectors on the gradual damage they undergo upon multiple cycles of cooling to the temperature of 77 K is investigated. The shape of the photodetector surface is controlled using the interference technique.

Keywords:

photodetector, interference technique

OCIS codes: 040.2480, 260.3160

References:

1. L. A. Novitskii and I. G. Kozhevnikov, Thermal-Physical Material Properties at Low Temperatures (Mashinostroenie, Moscow, 1975).
2. A. R. Novoselov and I. G. Kosulina, “On-line testing of flip-chip assemblies,” Optoelectron. Instrum. Data Process. 45(6), 587–589 (2009).
3. M. Greiner, M. Davis, J. Devitt, R. Rawe, D. R. Wade, and J. Voelker, “State of the art in large format IR FPA development at CMC Electronics, Cinncinati,” Proc. SPIE 5074, 60–71 (2003).
4. A. R. Novoselov, I. G. Kosulina, A. G. Klimenko, N. A. Valisheva, V. V. Vasil’ev, and S. A. Dvoretskii, “Increasing the mechanical strength of hybrid photodetectors based on mercury-cadmium-telluride heteroepitaxial layers,” Optoelectron. Instrum. Data Process. 49(1), 94–100 (2013).
5. D. Malakara, Optical Industrial Control (Mashinostroenie, Moscow, 1985).
6. A. R. Novoselov, P. A. Aldokhin, A. E. Matochkin, P. P. Dobrovolskii, and K. P. Shatunov, “Real-time control of nonflatness of components of infrared-range flip-chip photodetectors,” Optoelectron. Instrum. Data Process. 55(2), 162–171 (2019).